自动化专业英语求翻译

Another issue with the entire circuit is the frequency dependence of the models. We used isolated experiments to try to understand these effects, but a complete analysis is lacking. This is complicated by the fact that the entire circuit does not operate at 2.4 GHz. While these results did not affect the simulation of the TXA, which does operate at 2.4 GHz, when the IF portion is included the constant lumped element model parameter values may become less accurate. If this is true, a means of modeling the parasitic elements over a large frequency range is possible using algorithms for generating reduced order models directly from the quasistatic governing equations.

模型的频率相依关系是整个电路的另一个课题。我们通过进行个别的实验来了解这些效应，但却没有完整的分析。整个问题变得复杂化是因为电路在2.4 GHz的频率无法工作。尽管这些结果对于不在2.4 GHz频率上运作的TXA的模拟没有影响，然而，当加入中频的部分后，恒定集总元件模型参数值的准确率可能会下降。如果确实这样，直接从准静态控制方程式中运用生成降阶模型的演算，来作为大频率范围的寄生元件的建模途径是可行的。

Adding lumped element RLC models for the package leads, bondwires, DA plane, and on-chip interconnect provided accurate simulation results for the transmit amplifier of the HFA3624. It shows the importance of modeling the entire packaged IC and the effectiveness of the 3-D field solver codes. In particular the multipole accelerated method-of-moments capacitance and inductance codes were utilized extensively and proved to be an accurate means for characterizing interconnect.

在封装引线、接合线、DA面及片内互连线中添加集总元件RLC模型可以为HFA3624发送放大器提供准确的模拟结果。它显示出对整体封装集成电路建模的重要性，以及3-D磁场解算码的有效性。特别是多极加速矩量法的电容与电感码的广泛使用，而且被证实这是记录互连特性的准确方法。

As a result of this work, Harris Semiconductor has established a comprehensive package and interconnect modeling strategy based on 3-D electromagnetic simulation for all RF product developments. As part of this strategy, the public domain codes FastCap and FastHenry from MIT have been completely integrated into the design flow to provide fully automated extraction of bondwire, die attach, and on-chip interconnect models from layout data.

由于这研究的结果，Harris半导体公司为其所有射频产品的研发，建立了一套基于3-D电磁模拟的综合封装与互连的建模策略。作为这策略的一部分，麻省理工学院的公共领域代码FastCap和FastHenry已被完全融入到设计的流程，以便能够从布置数据中全自动地抽取接合线、芯片粘贴及片内互连的模型。

【英语牛人团】

我国SMIC成为世界第三大合约芯片生产商

据报道，我国大陆的合约半导体生产商中芯国际集成电路制造有限公司(SMIC)已经挤掉新加坡特许半导体制造公司，在2005年成为世界第三大硅芯片供应商。

SMIC去年的市场份额为6.4％，销售额11.7亿美元，年增20.1％，超过了特许半导体的6.2％、11.3亿美元、2.6％。

在SMIC之前位列第一和第二的分别是我国台湾的TSMC(台积电)和UMC(联电)。2005年TSMC的份额高达44.8％，销售额82.2亿美元，年增7.2％；UMC份额为15.4％，销售额28.2亿美元，下降19.3％。排名第五的是IBM生产部门，份额4.5％，销售额8.23亿美元，年增2.1％。

其他排名前十的合约芯片生产商还有：韩国MagnaChip半导体(2.1％，3.96亿美元)、台湾Vanguard国际半导体(1.9％，3.54亿美元)、韩国Dongbu半导体(1.9％，3.47亿美元)、我国上海Hua Hong NEC(1.7％，3.05亿美元)、美国捷智Jazz半导体(1.1％，2.10亿美元)。

芯片生产商一览表

A-Data Technology

Advanced Analogic Technologies

Advanced Linear Devices

Advanced Micro Devices （美国先进微电子器件公司）

Advanced Monolithic Systems

Advanced Power Technology

Advanced Semiconductor

AECO(日本阿伊阔公司)

AEG-TELEFUNKEN(德国德律风根公司)

Aeroflex Circuit Technology

Agere Systems

Agilent(Hewlett-Packard)

Allegro MicroSystems

Alpha Industries

Altera Corporation

AMIC Technology

ANADIGICS, Inc

Analog Devices (美国模拟器件公司)

Analog Intergrations Corporation

Analog Microelectronics

Analog Systems (美国模拟系统公司)

Apuls Intergrated Circuits

Asahi Kasei Microsystems

ATMEL Corporation

AUK corp

austriamicrosystems AG

AVX Corporation

AZ Displays

Boca Semiconductor Corporation

Brilliance Semiconductor

Burr-Brown Corporation

Bytes

C&D Technologies

California Micro Devices Corp

Calogic, LLC

Catalyst Semiconductor

Central Semiconductor Corp

Ceramate Technical

Cherry Semiconductor Corporation (美国切瑞半导体器件公司)

Chino-Excel Technology

Cirrus Logic

Clare, Inc.

CML Microcircuits

Comchip Technology

Compensated Deuices Incorporated

Cypress Semiconductor

Daewoo Semiconductor (韩国大宇电子公司)

Dallas Semiconducotr

Dc Components

DENSEI-LAMBDA

Diodes Incorporated

Diotec Semiconductor

Dynex Semiconductor

EIC discrete Semiconductors

ELAN Microelectronics Corp

Elantec Semiconductor

Elpida Memory

Epson Company

Ericsson

ETC

Etron Technology, Inc.

Exar Corporation

Fairchild Semiconductor (美国仙童公司)

Filtronic Compound Semiconductors

Formosa MS

Fuji Electric

Fujitsu Media Devices Limited (日本富士通公司)

General Semiconductor

General Instruments [GI] (美国通用仪器公司)

Gilway Technical Lamp

GOLD STAR[韩国金星(高尔达)电子公司]

GOOD-ARK Electronics

Hamamatsu Corporation

Harris Corporation

Hi-Sincerity Mocroelectronics

Hirose Electric

Hitachi Semiconductor (日本日立公司)

Hittite Microwave Corporation

Holt Integrated Circuits

Holtek Semiconductor Inc

Humirel

Hynix Semiconductor

IMP, Inc

Impala Linear Corporation

Infineon Technologies AG

InnovASIC, Inc

inntech (美国英特奇公司)

Integrated Circuit Solution Inc

Integrated Circuit Systems

Integrated Device Technology

Intel Corporation

International Rectifier

Intersil Corporation (美国英特锡尔公司)

ITT(德国ITT-半导体公司)

Jinan Gude Electronic Device

KEC(Korea Electronics)

Kemet Corporation

Knox Semiconductor, Inc

Kodenshi Corp

Kyocera Kinseki Corpotation

Lattice Semiconductor

LEM

Leshan Radio Company

Level One�?s

Linear Technology

Lite-On Technology Corporation

Littelfuse

LOGIC Devices Incorporated

LSI Computer Systems

Macronix International

Marktech Corporate

Matsushita Electric Works(Nais)

Maxim Integrated Products （美国）美信集成产品公司

Micrel Semiconductor

Micro Commercial Components

Micro Electronics

Micro Linear Corporation

MICRO NETWORK(美国微网路公司)

MICRO POWER SYSTEMS(美国微功耗系统公司)

AMERICAN MICRO SYSTEMS(美国微系统公司)

Microchip Technology

Micron Technology

Micropac Industries

Microsemi Corporation

Mitel Networks Corporation

MITEL SEMICONDUCTOR(加拿大米特尔半导体公司)

Mitsubishi Electric Semiconductor (日本三菱电机公司)

Mosel Vitelic, Corp

Mospec Semiconductor

MOSTEK(美国莫斯特卡公司)

Motorola, Inc (美国莫托罗拉半导体产品公司)

MULLARD(英国麦拉迪公司)

National Semiconductor (美国国家半导体公司)

NEC ELECTRON(日本电气公司)

New Japan Radio (新日本无线电公司)

Nippon Precision Circuits Inc

NITRON(美国NITROR公司)

NTE Electronics

OKI electronic componets (日本冲电气有限公司)(美国OKI半导体公司)

ON Semiconductor

OTAX Corporation

Pan Jit International Inc.

Panasonic Semiconductor (日本松下电器公司)

PerkinElmer Optoelectronics

Philips Semiconductors (荷兰菲利浦公司)

PLESSEY(英国普利西半导体公司) Plessey

PMC-Sierra, Inc

Polyfet RF Devices

Power Innovations Limited

Power Integrations, Inc.

Power Semiconductors

Power-One

Powerex Power Semiconductors

Powertip Technology

Precid-Dip Durtal SA

Princeton Technology Corp

PRO ELECTRON(欧洲电子联盟)

QT Optoelectronics

QUALCOMM Incorporated

RAYTHEON(美国雷声公司)

RCA(美国无线电公司)

Recom International Power

Rectron Semiconductor

RF Micro Devices

RICOH electronics devices division

Rohm (日本东洋电具制作所)(日本罗姆公司)

Sames

Samsung semiconductor (韩国三星电子公司)

Sanken electric (日本三肯电子公司)

Sanyo Semicon Device (日本三洋电气公司)

Seiko Instruments Inc

Seme LAB

Semicoa Semiconductor

Semtech Corporation

Semtech International Holdings Limited

SGS-ATES SEMICONDUCTOR(意大利SGS-亚特斯半导体公司)

Shanghai Lunsure Electronic Tech

Shanghai Sunrise Electronics

Sharp Electrionic Components [日本夏普(声宝)公司]

Shindengen Electric Mfg.Co.Ltd

Siemens Semiconductor Group (德国西门子公司)

SiGe Semiconductor, Inc.

SIGNETICS(美国西格尼蒂克公司)

SILICON GENERAL(美国通用硅片公司)

Silicon Storage Technology, Inc

Sipex Corporation

SOLITRON(美国索利特罗器件公司) Solitron

SONiX Technology Company

Sony Corporation (日本索尼公司)

SPRAGUE ELECTRIC(美国史普拉格电子公司)

SSS(美国固体科学公司)

STMicroelectronics

Supertex, Inc

Surge Components

System Logic Semiconductor

Taiwan Memory Technology

Taiyo Yuden (U.S.A.), Inc

Teccor Electronics

TelCom Semiconductor, Inc

TEMIC Semiconductors

TEXAR INTEGRATED SYSTEMS(美国埃克萨集成系统公司)

Texas Instruments (美国德克萨斯仪器公司)

Thermtrol Corporation

THOMSON-CSF(法国汤姆逊半导体公司)

TOKO, Inc

Tontek Design Technology

Torex Semiconductor

Toshiba Semiconductor

TRACO Electronic AG

Traco Electronic AG

TRANSYS Electronics Limited

TriQuint Semiconductor

TRSYS

TRW LSI PRODUCTS(美国TRW大规模集成电路公司)

Tyco Electronics

UMC Corporation

UNISEM

Unisonic Technologies

United Monolithic Semiconductors

Unity Opto Technology

Vaishali Semiconductor

Vanguard International Semiconductor

Vicor Corporation

Vishay Siliconix

Vishay Telefunken

Winbond

Wing Shing Computer Components

Wolfgang Knap

Wolfson Microelectronics plc

Won-Top Electronics

Xicor Inc.

Xilinx, Inc

YAMAHA(日本雅马哈公司)

Zetex Semiconductors

Zilog, Inc.

Zowie Technology Corporation

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