
World's first semiconductor rectifier and the transistor is, when no power semiconductor or microelectronics semiconductor division. In 1958, China began the first research topic Thyristor (originally known as PNPN device). In similar time, the study of integrated circuits began gradually. From semiconductor devices to the two direction. The former became the basis for power electronics, while the latter led to the development and micro-electronics and information electronics.
According to the system, power system devices are classified to the machinery, integrated circuits, electronic systems are included. As the semiconductor leader in the electronic systems, coupled with the semiconductor integrated circuits is the main body, which after a long-term evolution of integrated circuits in a number of occasions, has become almost synonymous with semiconductor devices only.
At the end of the sixties and early seventies, the country has set off a "SCR" hot. The boom continued a long time, great influence, and therefore still believe that the domestic power of semiconductors is the main SCR. The late seventies, the development of a thyristor family. And called the name of a standardized "thyristor." As the technology to regulate the power switch, so the wear and tear on a small device, so as the energy trump card. Its application is to cover all fields. China was first mooted in 1979, the establishment of Power Electronics Society, IEEE slightly earlier than the establishment of the United States Institute of Power Electronics (Power Electronics Society). Power Electronics Society of China was founded, as a result of the importance of professional development is very rapid. However, because the focal point was the relationship, it does not like the United States become an independent professional institutes, and was subsequently set up part of the China Electrotechnical Society.
The translation and definition of Power Electronics for Power Electronics (the original idea was also known as the Power Electronics), and the popularity of power electronics played a role. Mechanical, electrical, electronic and other departments are very concerned about its development. Related to the power semiconductor devices has also been known as the power electronic devices. However, this name is very difficult to find abroad, but the corresponding terms. "Electricity" in reference to electronic access to universal, but also left a number of sequels. People mistakenly believe that only high-power direction is the "power" of the main electronic devices, and the difficulty of the rapid development of the MOSFET as a "power electronics" of the other main. From that point, I would like to use power semiconductor devices as the subject of this article, and power electronic devices can be used to express a broader sense to include other non-semiconductor, including a variety of power electronic devices.
The development of power semiconductor devices in three stages
The development of power semiconductor devices can be divided into three stages. The first stage is 60 to the seventies, when the various types of thyristors and power transistors Darlington significant development, or what might be called the era of bipolar. Its clients are mainly for industrial applications, including power systems, such as locomotive traction. The second stage is 80 to the nineties, due to the rise of the power MOSFET to power electronics into a new area. Modern 4C booming industry: the Communication, Computer, Consumer, Car (communication, computer, consumer electronics, automobiles) to provide a new vitality. Before and after the twenty-first century, the development of power semiconductor devices have entered the third phase, that is, and integrated circuit combined with a growing stage, Figure 1 and Figure II made to the above description of a simple sum. Of course, first of all need to focus on that here is this: when the continuous development of power semiconductor devices, the previous stage has not been the dominant product from the stage of history. For example, SCR is still an important product. China has in recent years the introduction of ultra-high-power thyristor, thyristor-controlled technology, such as China's major power transmission project, providing a key device. Recently, in considering the introduction of IGCT technology. In this regard it should be said that has gradually moved towards the world. This is our country going on the many major infrastructure. Although the view from the United States, the production of high-power thyristors have been less and less on the economic development of the two countries are not identical. I draw in Figure 2 in power semiconductor devices in both directions in the development. The left side of the bipolar nature of the direction toward the integration of ultra-high-power and direction. The right direction is unipolar, it is more established and integrated circuits of the inseparable relationship between closely.
功率半导体器件,也叫电力电子器件均具有导通和阻断两种工作特性。原理是:通过控制门极信号控制功率半导体器件的导通和关断。半控型器件,只可控制其导通,不可控制其关断。全控型器件,导通和关断都可控制。半导体是一种电导率在绝缘体至导体之间的物质,其电导率容易受控制,可作为信息处理的元件材料。从科技或是经济发展的角度来看,半导体非常重要。很多电子产品,如计算机、移动电话、数字录音机的核心单元都是利用半导体的电导率变化来处理信息。常见的半导体材料有硅、锗、砷化镓等,而硅更是各种半导体材料中,在商业应用上最具有影响力的一种。基本简介
半导体
顾名思义:常温下导电性能介于导体(conductor)与绝缘体(insulator)之间的材料,叫做半导体(semiconductor)。
物质存在的形式多种多样,固体、液体、气体、等离子体等等。我们通常把导电性和导电导热性差或不好的材料,如金刚石、人工晶体、琥珀、陶瓷等等,称为绝缘体。而把导电、导热都比较好的金属如金、银、铜、铁、锡、铝等称为导体。可以简单的把介于导体和绝缘体之间的材料称为半导体。与导体和绝缘体相比,半导体材料的发现是最晚的,直到20世纪30年代,当材料的提纯技术改进以后,半导体的存在才真正被学术界认可。
半导体的分类,按照其制造技术可以分为:集成电路器件,分立器件、光电半导体、逻辑IC、模拟IC、储存器等大类,一般来说这些还会被分成小类。此外还有以应用领域、设计方法等进行分类,虽然不常用,单还是按照IC、LSI、VLSI(超大LSI)及其规模进行分类的方法。此外,还有按照其所处理的信号,可以分成模拟、数字、模拟数字混成及功能进行分类的方法。
基本定义
电阻率介于金属和绝缘体之间并有负的电阻温度系数的物质。
半导体室温时电阻率约在10E-5~10E7欧·米之间,温度升高时电阻率指数则减小。
半导体材料很多,按化学成分可分为元素半导体和化合物半导体两大类。
锗和硅是最常用的元素半导体;化合物半导体包括Ⅲ-Ⅴ 族化合物(砷化镓、磷化镓等)、Ⅱ-Ⅵ族化合物(硫化镉、硫化锌等)、氧化物(锰、铬、铁、铜的氧化物),以及由Ⅲ-Ⅴ族化合物和Ⅱ-Ⅵ族化合物组成的固溶体(镓铝砷、镓砷磷等)。除上述晶态半导体外,还有非晶态的玻璃半导体、有机半导体等。
半导体(东北方言):意指半导体收音机,因收音机中的晶体管由半导体材料制成而得名。
本征半导体
不含杂质且无晶格缺陷的半导体称为本征半导体。在极低温度下,半导体的价带是满带(见能带理论),受到热激发后,价带中的部分电子会越过禁带进入能量较高的空带,空带中存在电子后成为导带,价带中缺少一个电子后形成一个带正电的空位,称为空穴。导带中的电子和价带中的空穴合称电子 - 空穴对,均能自由移动,即载流子,它们在外电场作用下产生定向运动而形成宏观电流,分别称为电子导电和空穴导电。这种由于电子-空穴对的产生而形成的混合型导电称为本征导电。导带中的电子会落入空穴,电子-空穴对消失,称为复合。复合时释放出的能量变成电磁辐射(发光)或晶格的热振动能量(发热)。在一定温度下,电子 - 空穴对的产生和复合同时存在并达到动态平衡,此时半导体具有一定的载流子密度,从而具有一定的电阻率。温度升高时,将产生更多的电子 - 空穴对,载流子密度增加,电阻率减小。无晶格缺陷的纯净半导体的电阻率较大,实际应用不多。
分立功率器件按照功率的大小划分为大功率半导体器件和中小功率半导体器件。具体来说,大功率晶闸管专指承受电流值在200A 以上的晶闸管产品;大功率模块则指承受电流25A 以上的模块产品;大功率IGBT、MOSFET 指电流超过50A 以上的IGBT、MOSFET 产品。
1956 年美国贝尔实验室(Bell Lab)发明了晶闸管,国际上,70 年代各种类型的晶闸管有了很大发展,80 年代开始加快发展大功率模块,同时各种大功率半导体器件在欧美日有很大的发展,90 年代IGBT 等全控型器件研制成功并开始得到应用。
在国内,60 年代晶闸管研究开始起步,70 年代研制出大功率的晶闸管,80年代以来,大功率晶闸管在中国得到很大发展,同时开始研制模块;本世纪以来,开始少量引进超大功率晶闸管(含光控晶闸管)技术;近年来国家正在逐步引进IGBT、MOSFET 技术。中国宏观经济的不断成长,带动了大功率半导体器件技术的发展和应用的不断深入。
晶闸管、模块、IGBT 的发明和发展顺应了电力电子技术发展的不同需要,是功率半导体发展历程中不同时段的重要标志产品,他们的应用领域、应用场合大部分不相同,小部分有交叉。在技术不断发展和工艺逐步改善的双重推动下,[1]大功率半导体器件将向着高电压、大电流、高频化、模块化、智能化的方向发展。在10Khz 以下、大功率、高电压的场合,大功率晶闸管和模块具有很强的抗冲击能力及高可靠性而占据优势,同时又因成本较低、应用简单而易于普及。在10Khz 以上、中低功率场合,IGBT、MOSFET 以其全控性、适用频率高而占据优势。
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